SMT termiskā profilēšana

Reflow profiling requires 4-phase optimization: Preheat (1-3 degree /s), Soak (60-120s at 150-180 degree ), Reflow (30-60s above 217 degree ), Cooling (<6°C/s). KIC thermal profilers use predictive algorithms for complex boards. Thermocouples attach to thermal mass areas for accuracy. Nitrogen environments permit 10°C lower peak temperatures. Ramp-to-spike profiles reduce tombstoning. DOE methods correlate profile settings with shear strength. Standards: IPC-7531 guidelines for profile validation.