Mitruma jutīga vadāmība

MSL (mitruma jutības līmenis) atbilstība novērš "popkornu" bojājumus. IPC/JEDEC J-STD -033 Definē Bake-Out protokolus: 3. līmeņa komponentos nepieciešams 168 struta dzīves laiks<30% RH. Dry cabinets maintain <5% humidity with nitrogen purge. Baking profiles: 125°C for 24hrs for moisture removal. Component packaging includes humidity indicator cards and moisture-barrier bags. Failure analysis detects delamination via scanning acoustic microscopy. High-reliability medical devices mandate Level 1 handling.